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Optical MEMS
Scientists at Xerox Corporation are conducting advanced research into
micro-opto-electromechanical systems (MOEMS), or microscopic machines on a
chip, to find ways of using the devices to boost performance, speed and
cost-efficiency of Xerox products. A futuristic vision for decades, MEMS is now
emerging from the shadow of microelectronics to be a field all its own. Xerox,
which has spent the last several years miniaturizing its functionality into
smaller and smaller spaces, is an industry leader in advancing the development
of silicon-based MEMS.
Technology Description
A MEMS device combines the computational functionality of the integrated
circuit with the sensory ability of a mechanical device, though it has more in
common with a robot than it does with a transistor. A MEMS device can discern
when something has happened and react to it. And, like an integrated circuit, a
MEMS device can also compute.
Xerox’s technology breaks the bandwidth barrier that exists today by
integrating an Optical MEMS photonic switch with planar light circuits on a
single silicon chip small enough to fit on a fingertip - a first ever
achievement. The breakthrough could assist the effort to bring affordable,
high-capacity fiber optics directly to businesses and even homes.
The new switch promises to provide rapid delivery of optical services by
providing the functionality of a Reconfigurable Optical Add/Drop Multiplexer
(R-OADM), a routing device that's commonly used today but is 10 to 100 times as
large and costly.
Optical networks based on Xerox technology could go way beyond delivering
on-demand DVD-quality videos in homes - it could help usher in a new era of
undreamed-of Internet applications, changing the way we do business, seek
information and find entertainment.
Advantages
Today's optical networking equipment must switch from the optical to the
electronic domain. Xerox's technology enables switching in the all-optical
domain. Because it controls the flow of light rather than the flow of
electrons, it is ultimately faster, smaller and cheaper.
With the Xerox switch, an entire R-OADM can be compressed into 2 cm x 1.5 cm in
size, and can direct enormous amounts of data in ways that currently require
large racks of assembled equipment.
"Waveguides" are very small conductors of light, about 5 to 6 microns or 1/10
the thickness of a human hair. The Xerox MOEMS waveguide shuttle acts like a
miniature train track switch for the fine waveguides, avoiding the problems of
earlier, mirror-based MOEMS switches.
The MOEMS switches and waveguides are made together on a single crystal silicon
wafer using widely available semiconductor processing equipment. Such on-chip
integration avoids the complex alignment issues associated with manually
connecting different and larger components with optical fibers, and avoids the
cost and space associated with manufacturing, assembling and packaging the
separate components of Add/Drop Multiplexers.
In addition, the new technology eliminates the need for technicians to make
routing changes in the field, ultimately bringing bandwidth to consumers faster.
Applications
Xerox research has resulted in the fabrication of MOEMS that require minimal
interconnects, which increases reliability and also decreases manufacturing
cost - both important factors to the continued adoption of MOEMS in biomedical,
telecommunications, automotive and aerospace industries.
The Xerox MOEMS technology can be leveraged to benefit other industries as
well. For instance, in optical fiber switching and industrial automation, the
use of MOEMS micro-mirrors can also be used to move light beams.
Another potential application for MOEMS devices is in Signature Analysis for
Xerox printers and copiers. Signature Analysis is a technology that monitors a
machine’s components for “signature” vibrations that may indicate a part
failure is imminent. MEMS devices with tiny tuning forks can facilitate this by
capturing vibration and transmitting it to the machine’s diagnostic equipment
for analysis.
The versatility, functionality, reliability and cost savings of MOEMS
technology will be a key advantage in many industries.
Xerox MEMS History
The new optical switch technology builds on a broadly enabling MOEMS
fabrication platform developed under a grant provided by the National Institute
of Standards and Technology in its Advanced Technology Program. Xerox is the
lead partner in the Optical MEMS Manufacturing Consortium. Other partners
include Palo Alto Research Center, a subsidiary of Xerox; Corning IntelliSense,
a MEMS foundry and software company; Microscan, a data acquisition firm; and
Coventor, a MEMS software company. They are tasked with developing a
manufacturing process for Optical MEMS, which can be used broadly.
In addition, Xerox is a founding partner in New York State's recently announced
Center for Excellence in Microsystems and Photonics, an advanced research and
manufacturing facility that will help speed the transformation of this research
into reality.
At Xerox, MEMS research began in 1993 and Optical MEMS in 1998. Using Optical
MEMS, Xerox is working to improve color image quality during the color
reproduction process. Optical MEMS devices could eventually eliminate the need
for high-cost precision manufacturing of components that stabilize movement in
Xerox photoreceptor belts.
For the first time, Xerox researchers have developed, on a single silicon chip,
technology that could help route high-capacity fiber optics "the last mile" to
small businesses and homes. The technology is drastically smaller and much
cheaper than devices currently in use. The Optical MEMS (Micro
Electro-Mechanical Systems) switch is integrated with light circuits to route
fiber optic signals.
Intellectual Property Summary
Xerox Intellectual Property includes patents, patent applications, and know-how.
For your convenience and review, we have provided a sample of selected patents
from our portfolio.
| U.S.
7450797 |
Beam switch structures
and methods |
| U.S. 7298954 |
Waveguide shuttle MEMS variable
optical attenuator |
| U.S.
7274842 |
Actuator and systems and
methods |
| U.S. 7242825 |
Cantilever beam MEMS variable
optical attenuator |
| U.S.
7224883 |
Actuator and latching
systems and methods |
| U.S. 7221817 |
Beam switch structures and
methods |
| U.S.
7162112 |
Microfabrication process
for control of waveguide gap size |
| U.S. 7116880 |
Decreased crosstalk in adjacent
photonic waveguides |
| U.S.
7116855 |
Optical shuttle system
and method used in an optical switch |
| U.S. 7070699 |
Bistable microelectromechanical
system based structures, systems and methods |
| U.S.
7016587 |
Low loss silicon
waveguide and method of fabrication thereof |
| U.S. 6990265 |
Monolithic reconfigurable optical
multiplexer systems and methods |
| U.S.
6987920 |
Waveguide structures and
methods |
| U.S. 6985651 |
Thermal actuator with offset beam
segment neutral axes and an optical waveguide switch including the same |
| U.S.
6985650 |
Thermal actuator and an
optical waveguide switch including the same |
| U.S. 6983088 |
Thermal actuator and an optical
waveguide switch including the same |
| U.S.
6980727 |
Methodology for a MEMS
variable optical attenuator |
| U.S. 6968100 |
MEMS waveguide shuttle optical
latching switch |
| U.S.
6947624 |
MEMS optical latching
switch |
| U.S. 6904191 |
MXN cantilever beam optical
waveguide switch |
| U.S.
6828887 |
Bistable
microelectromechanical system based structures, systems and methods |
| U.S. 6828171 |
Systems and methods for thermal
isolation of a silicon structure |
| U.S.
6661070 |
Micromechanical and
microoptomechanical structures with single crystal silicon exposure step |
| U.S. 6658179 |
Monolithic reconfigurable optical
multiplexer systems and methods |
| U.S.
6580858 |
Micro-opto-electro-mechanical system (MOEMS) |
| U.S. 6510275 |
Micro-optoelectromechanical system
based device with aligned structures and method for fabricating same |
| U.S.
6506620 |
Process for manufacturing
micromechanical and microoptomechanical structures with backside
metalization |
| U.S. 6479315 |
Process for manufacturing
micromechanical and microoptomechanical structures with single crystal silicon
exposure step |
| U.S.
6479311 |
Process for manufacturing
micromechanical and microoptomechanical structures with pre-applied
patterning |
| U.S. 6413793 |
Method of forming protrusions on
single crystal silicon structures built on silicon-on-insulator wafers |
| U.S.
6379989 |
Process for manufacture
of microoptomechanical structures |
| U.S. 6362512 |
Microelectromechanical structures
defined from silicon on insulator wafers |
| U.S.
5248379 |
Method to manufacture
lenses, optical systems and focusing mirrors by micromachining |
For Licensing Information
To learn more about licensing the Optical MEMS technology.
|
United States
