Xerox developed MEMS technologies to support our thermal ink jet (TIJ) product lines. The manufacture of the MEMS components for these products required the development of new technologies enabling the production of exceptionally precise channels and other structures on silicon using standard semiconductor etching processes. Orientation dependent etching technology is one of the most precise fabrication processes available for building accurate structures on the surface of a silicon chip. This process, together with precision dicing, chip placement and metrology can produce macroscopic structures 20cm or more across while maintaining micron-level tolerances. In addition, our surface coating technologies make it possible to manipulate and transport a wide variety of fluids without effecting the adjacent electronic circuitry. Finally, our matrix addressing technology enables the fabrication of these structures with a minimum of interconnects, ultimately producing a more reliable and less-expensive component.